Temporary extrusion/failures in accelerated lifetime tests of copper interconnects

IEEE Electron Device Letters

Volumn 26, Issue 9, 2005, Pages 622-624

  Zhang, Y ^a   Choy, J H ^a   Chapman, G H ^a   Kavanagh, K L ^a  

^a SIMON FRASER UNIVERSITY   (Canada)

Author keywords

Capillary force; Copper damascene technology; Electromigration; Electron wind force; Soft failure; Temporary extrusion

Indexed keywords

COPPER; ELECTRIC FIELDS; ELECTROMIGRATION; LEAKAGE CURRENTS; SHORT CIRCUIT CURRENTS;

CAPILLARY FORCE; COPPER DAMASCENE TECHNOLOGY; ELECTRON WIND FORCE; SOFT FAILURE; TEMPORARY EXTRUSION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 26444596567     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2005.854356     Document Type: Article

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