Analysis and characterization of device variations in an LSI chip using an integrated device matrix array

IEEE Transactions on Semiconductor Manufacturing

Volumn 17, Issue 2, 2004, Pages 155-165

  Ohkawa, Shin Ichi ^a   Aoki, Masakazu ^b   Masuda, Hiroo ^a  

^a Semiconduct Technol Acad Res C   (Japan)

^b TOKYO UNIVERSITY OF SCIENCE   (Japan)

Author keywords

Correlation analysis; Device variation; Leakage control; Parameter measurement; Polynomial fitting; Statistical analysis; Switching matrix; Variance characteristic; Variance decomposition; Within die variation

Indexed keywords

DECOMPOSITION; INTEGRATED CIRCUITS; MATRIX ALGEBRA; MICROPROCESSOR CHIPS; MOSFET DEVICES; POLYNOMIALS; RESISTORS; TRANSISTORS;

DEVICE VARIATION; LEAKAGE CONTROL; PARAMETER MEASUREMENT; POLYNOMIAL FITTING; SWITCHING MATRIX; VARIANCE CHARACTERISTIC; VARIANCE DECOMPOSITION; WITHIN DIE VARIATION;

LSI CIRCUITS;

EID: 2642517064     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2004.827001     Document Type: Conference Paper

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