Effective thermal conductivity of common geometric shapes

International Journal of Heat and Mass Transfer

Volumn 48, Issue 23-24, 2005, Pages 4779-4796

  Brucker, Kyle A ^a   Majdalani, Joseph ^a  

^a Mechanical Aerospace and Biomedical Engineering The University of Tennessee (UTSI)   (United States)

Author keywords

Coarse model; Compact heat sink; Extended surface; Flat plate; Porous fluid block

Indexed keywords

APPROXIMATION THEORY; CORRELATION METHODS; FINS (HEAT EXCHANGE); HEAT CONVECTION; ISOTHERMS; MATHEMATICAL MODELS; NUSSELT NUMBER;

COARSE MODEL; COMPACT HEAT SINK; EXTENDED SURFACE; FLAT PLATE; POROUS FLUID BLOCK;

THERMAL CONDUCTIVITY;

FLAT PLATE; HEAT EXCHANGER; THERMAL CONDUCTIVITY;

EID: 25444492925     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2005.05.007     Document Type: Article

References (63)

1. Y.A. Çengel Heat Transfer: A Practical Approach 1998 McGraw-Hill New York
2. A. Bar-Cohen, and A.D. Kraus Advances in Thermal Modeling of Electronic Components and Systems vol. 2 1990 ASME Press New York
3. W.M. Kays, and A.L. London Compact Heat Exchangers second ed. 1964 McGraw-Hill New York
4. D.B. Tuckerman, and R.E. Pease High-performance heat sinking for VLSI IEEE Electron. Device Lett. 2 1981 126 129
5. N. Goldberg Narrow channel forced air heat sink IEEE Trans. Comp. Hybrids Manuf. Technol. 1 1984 154 159
6. S. Sasaki, and T. Kishimoto Optimal structure for microgroove cooling fin for high power LSI devices Electron. Lett. 22 1986 1332 1334
7. L.T. Hawang, I. Turlik, and A. Reisman A thermal module design for advanced packaging J. Electron. Mater. 16 1987 347 355
8. D. Nayak, L.T. Hawang, I. Turlik, and A. Reisman A high-performance thermal module for computer packaging J. Electron. Mater. 16 1987 357 364
9. R.J. Phillips Microchannel heat sinks A. Bar-Cohen A.D. Kraus Advances in Thermal Modeling of Electronic Components and Systems vol. 2 1990 ASME Press New York (Chapter 3)
10. S. Gavali, S.V. Patankar, K.C. Karki, and K. Miura Effect of heat sink on forced convection cooling of electronic components: a numerical study Adv. Electron. Pack. 4 1993
11. M.A. Butterbaugh, and S.S. Kang Effect of airflow bypass on the performance of heat sinks in electronic cooling Adv. Electron. Pack. 10 1995 846 848
12. J.A. Visser, P. Gauche, A computer model to simulate heat transfer in heat sinks, in: Proceedings of the Fourth International Conference for Advanced Computational Methods in Heat Transfer, Udine, 1996, pp. 105-114.
13. A. Bar-Cohen Air-cooled heat sinks-trends and future directions Adv. Electron. Pack. 19 1997
14. K. Azar, R.S. McLeod, R.E. Caron, Narrow channel heat sink for cooling of high powered electronic components, in: Eighth IEEE SEMI-THERM Symposium, 1992, pp. 12-19.
15. P.R. Souza Mendes, and W.F.N. Santos Heat-transfer and pressure drop experiments in air-cooled electronic component arrays AIAA J. Thermophys. Heat Transfer 1 1987 373 378
16. M.R. Vogel, Thermal performance of air-cooled hybrid heat sinks for a low velocity environment, in: Tenth IEEE SEMI-THERM Symposium, 1994, pp. 17-22.
17. R.A. Wirtz, W. Chen, and R. Zhou Effects of flow bypass on the performance of longitudinal fin heat sinks ASME J. Electron. Pack. 116 1994 206 211
18. A. Bar-Cohen, T. Elperin, and R. Eliasi qjc characterization of chip packages-justification, limitations, and future IEEE Trans. Comp. Hybrids Manuf. Technol. 12 1989 724 731
19. W. Krueger, and A. Bar-Cohen Thermal characterization of a PLCC-expanded Rjc methodology IEEE Trans. Comp. Hybrids Manuf. Technol. 15 1992 691 698
20. J.R. Culham, M.M. Yovanovich, S. Lee, Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection, in: Concurrent Engineering and Thermal Phenomena Proceedings of the Intersociety Conference on Thermal Phenomena in Electronic Systems, vol. 94CH3340, Piscataway, NJ, 1994, pp. 73-82.
21. J.R. Culham, M.M. Yovanovich, and S. Lee Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection IEEE Trans. Comp. Pack. Manuf. Technol. 18 1995 559 566
22. R.L. Linton, and D. Agonafer Coarse and detailed CFD modeling of a finned heat sink IEEE Trans. Comp. Pack. Manuf. Technol. 18 1995 517 520
23. C.D. Patel, C.L. Belady, Modeling and metrology in high performance heat sink design, in: IEEE Electron. Comp. Technol. Conf., Phoenix, AZ, 1997, pp. 296-302.
24. C.D. Patel, and C.L. Belady Modeling and Metrology in High Performance Heat Sink Design 1997 Hewlett Packard Laboratories Palo Alto, CA
25. S. Kim, S. Lee, On heat sink measurement and characterization, in: IPACK, vol. INTERPACK'97, Hawaii, 1997, pp. 1903-1909.
26. S. Narasimhan, and B. Kusha Characterization and verification of compact heat sink models Proc. Heat Trans. Fluid Mech. Inst. 1998 43 46
27. S. Narasimhan, J. Majdalani, Characterization of compact heat sink models in natural convection, in: IPACK, vol. 2001-15889, Kauai, Hawaii, 2001.
28. S. Narasimhan, and J. Majdalani Characterization of compact heat sink models in natural convection IEEE Trans. Comp. Pack. Manuf. Technol. 25 2002 78 86
29. J.A. Andrews, M. Mahalingam, and H. Berg Thermal characteristics of 16- and 40-pin plastic DIPs IEEE Trans. Comp. Hybrids Manuf. Technol. 4 1981 455 461
30. J.A. Andrews Package thermal resistance model dependency on equipment design IEEE Trans. Comp. Hybrids Manuf. Technol. 11 1988 528 537
31. M. Mahalingam Surface-mount plastic packages-an assessment of their thermal performance IEEE Trans. Comp. Hybrids Manuf. Technol. 12 1989 745 752
32. Gautier, Construction and validation of thermal models of packages, in: Seventh IEEE SEMI-THERM Symposium, 1991, pp. 74-79.
33. J.P. Le Jannou, and Y. Huon Representation of thermal behavior of electronic components for the creation of a databank IEEE Trans. Comp. Hybrids Manuf. Technol. 14 1991 366 373
34. T.F. Lemczyk, J.R. Culham, S. Lee, M.M. Yovanovich, Fopt-a thermal optimization factor for microelectronic packages, in: Eighth IEEE SEMI-THERM Symposium, 1992, pp. 89-94.
35. T.F. Lemczyk, B.L. Mack, J.R. Culham, and M.M. Yovanovich PCB trace thermal analysis and effective conductivity J. Electron. Pack. 114 1992 413 419
36. C.J.M. Lasance, H. Vinke, and H. Rosten Thermal characterization of electronic devices with boundary condition independent compact models IEEE Trans. Comp. Pack. Manuf. Technol. 18 1995 723 731
37. S. Narasimhan, A. Bar-Cohen, and R. Nair Thermal compact modeling of parallel plate heat sinks IEEE Trans. Comp. Pack. Manuf. Technol. 26 2003 136 146
38. P. Teertstra, M.M. Yovanovich, and J.R. Culham Pressure loss modeling for surface mounted cuboid-shaped packages in channel flow IEEE Trans. Comp. Pack. Manuf. Technol. 20 1997 463 469
39. S. Narasimhan, A. Bar-Cohen, and R. Nair Flow and pressure field characteristics in the porous block compact modeling of parallel plate heat sinks IEEE Trans. Comp. Pack. Manuf. Technol. 26 2003 147 157
40. S.W. Churchill, and H.H.S. Chu Correlating equations for laminar and turbulent free convection from a vertical plate Int. J. Heat Mass Transfer 18 1975 1323 1329
41. A.D. Kraus, and A. Bar-Cohen Thermal Analysis and Control of Electronic Equipment 1983 Hemisphere New York
42. S.W. Churchill, and R.U. Churchill A comprehensive correlating equation for heat an component transfer by free convection AIChE J. 21 1975 604 606
43. G. Cardano The Rules of Algebra 1993 Dover New York
44. K. Brucker, and J. Majdalani Effective thermal conductivity for compact heat sink models based on the Churchill and Chu correlation IEEE Trans. Comp. Pack. Manuf. Technol. 26 2003 158 164
45. M. Jakob Heat Transfer vol. 1 1949 John Wiley New York
46. T. Yuge Experiments on heat transfer from spheres including combined natural and forced convection J. Heat Trans. 82 1960 214 220
47. S. Whitaker Forced convection heat transfer correlations for flow in pipes, past flat plates, single cylinders, single spheres, and for flow in packed beds and tube bundles AIChE J. 18 1972 361 371
48. W.H. McAdams Heat Transmission third ed. 1954 McGraw-Hill New York
49. C.Y. Warner, and V.S. Arpaci An experimental investigation of turbulent natural convection in air at low pressure Int. J. Heat Mass Transfer 11 1968 397 406
50. E.R.G. Eckert, T.W. Jackson, Analysis of turbulent free convection boundary layer on a flat plate, NASA Technical No. NACA 1015, 1951.
51. J.R. Lloyd, and W.R. Moran Natural-convection adjacent to horizontal surface of various planforms J. Heat Transfer 96 1974 443 447
52. T. Fujii, and H. Imura Natural convection heat transfer from a plate with arbitrary inclination Int. J. Heat Mass Transfer 15 1972 755 767
53. S.W. Churchill Free convection around immersed bodies K.J. Bell Heat Exchanger Design Handbook 1983 Hemisphere Washington, DC
54. M.M. Yovanovich On the effect of shape, aspect ratio and orientation upon natural convection from isothermal bodies of complex shapes Y. Jaluria R.S. Figliola M. Kaviany Convective Transport HTD-Vol. 82 1987 ASME 121 129
55. S.W. Churchill, and H.H.S. Chu Correlating equations for laminar and turbulent free convection from a horizontal cylinder Int. J. Heat Mass Transfer 18 1975 1049 1053
56. V.T. Morgan The Overall Convective Heat Transfer from Smooth Circular Cylinders vol. 11 1975 Academic Press New York
57. M. Al-Arabi, and M. Khamis Natural convection heat transfer from inclined cylinders Int. J. Heat Mass Transfer 25 1982 3 15
58. P.H. Oosthuizen, and E. Donaldson Free convection heat transfer from vertical cones J. Heat Transfer 94 1972 330 331
59. E.R.G. Eckert Engineering relations for heat transfer and friction in high-velocity laminar and turbulent boundary layer flow over surfaces with constant pressure and temperature Trans. ASME 78 1956 1273 1284
60. H.H. Sogin A summary of experiments on local heat transfer from the rear of bluff obstacles to a lowspeed airstream ASME J. Heat Transfer 86 1964 200 202
61. K.K. Tien, and E.M. Sparrow Local heat transfer and fluid flow characteristics for airflow oblique or normal to a square plate Int. J. Heat Mass Transfer 22 1979 349 360
62. E.M. Sparrow, and G.T. Geiger Local and average heat transfer characteristics of a disk situated perpendicular to a uniform flow J. Heat Transfer 107 1985 321 326
63. G.L. Wedekind Convective heat transfer measurement involving flow past stationary circular disks J. Heat Transfer 111 1989 1098 1100