Flow and pressure field characteristics in the porous block compact modeling of parallel plate heat sinks

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 147-157

  Narasimhan, Sridhar ^a   Bar Cohen, Avram ^a   Nair, Rajesh ^b  

^a University of Minnesota   (United States)

^b ANSYS INC   (United States)

Author keywords

Compact model; Loss coefficients; Parallel plate heat sinks; Simplified heat sinks

Indexed keywords

APPROXIMATION THEORY; COMPUTATIONAL COMPLEXITY; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FORCED CONVECTION; PRESSURE DROP; SEMICONDUCTOR DEVICE MODELS; THERMAL CONDUCTIVITY OF SOLIDS;

EQUIVALENT LOSS COEFFICIENT; PARALLEL PLATE HEAT SINKS; PRESSURE LOSS COEFFICIENT; SOFTWARE PACKAGE ICEPAK;

HEAT SINKS;

EID: 0037698991     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.811861     Document Type: Article

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