Characterization of compact heat sink models in natural convection

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 1, 2002, Pages 78-86

  Narasimhan, Susheela ^a   Majdalani, Joseph ^b  

^a CISCO SYSTEMS   (United States)

^b Marquette University   (United States)

Author keywords

Compact heat sink; Effective conductivity; Fluid block; Multichip electronic cooling

Indexed keywords

CHARACTERIZATION; COMPUTATIONAL METHODS; COMPUTER SIMULATION; COMPUTER SOFTWARE; COOLING; FINS (HEAT EXCHANGE); HEAT RESISTANCE; HEAT SINKS; ITERATIVE METHODS; LAMINAR FLOW; MATHEMATICAL MODELS; MULTICHIP MODULES; NUSSELT NUMBER; THERMAL CONDUCTIVITY;

MULTICHIP ELECTRONIC COOLING;

NATURAL CONVECTION;

EID: 0036505127     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.991179     Document Type: Article

References (18)

1. Effect of common design parameters on the thermal performance of microelectronic equipment. Part 1 - Natural convection
2. Modeling and metrology in high performance heat sink design
3. Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection
4. Narrow channel heat sink for cooling of high powered electronic components
5. Optimal design of forced convection heat sinks - Analytical
6. Heat sink optimization with application to microchannels
7. Optimal structure for microgroove cooling fin for high power LSI devices
8. Optimization of plate fin heat sinks using entropy generation minimization
9. Optimum design and selection of heat sinks
10. Optimization of extruded type external heat sink for multichip module
11. Correlating equations for laminar and turbulent free convection from a vertical plate
12. The Prandtl number effect on the transition in natural convection along a vertical surface
13. Pressure loss modeling for surface mounted cuboid-shaped packages in channel flow