Equivalent thermal conductivity for compact heat sink models based on the churchill and chu correlation

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 158-164

  Brucker, Kyle A ^a   Majdalani, Joseph ^b  

^a Cornell University   (United States)

^b Marquette University   (United States)

Author keywords

Compact heat sink; Equivalent conductivity; Fluid block; Multichip electronic cooling

Indexed keywords

CALCULATIONS; CORRELATION METHODS; ELECTRONICS PACKAGING; HEAT TRANSFER COEFFICIENTS; ITERATIVE METHODS; NUSSELT NUMBER; PRANDTL NUMBER; SEMICONDUCTOR DEVICE MODELS; THERMAL CONDUCTIVITY OF SOLIDS;

COMPACT HEAT SINK; EQUIVALENT THERMAL CONDUCTIVITY; GRASHOF NUMBER; MULTICHIP ELECTRONIC COOLING; RAYLEIGH NUMBER;

HEAT SINKS;

EID: 0038142361     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.806173     Document Type: Article

References (13)

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