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Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment
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Cooling electronic components: Forced convection experiments with an air-cooled array
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Proc. 23rd Nat'l Heat Transfer Conf., Denver, CO, Aug. 4-7, 1985, ASME
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Moffat, R.J.1
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Heat transfer and pressure drop experiments in air-cooled electronic-component arrays
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0030109826
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Comparison of the cooling performance of staggered and in-line arrays of electronics packages
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Wirtz, R.A.1
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Three-dimensional heat transfer and fluid flow analysis of arrays of square blocks encountered in electronic equipment
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Parametric study of turbulent three-dimensional heat transfer of arrays of heated blocks encountered in electronic equipment
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Forced convective heat transfer from LSI packages in an air-cooled wiring card array
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Proc. Winter Ann. Meet. ASME, Boston, MA, Nov. 13-18, 1983, ASME
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A new correlation for pressure drop in arrays of rectangular blocks in air-cooled electronics units
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Molki, M.1
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Some observations on skin friction and velocity profiles in fully developed pipe and channel flows
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Low Reynolds number turbulent flow in large aspect ratio rectangular ducts
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Beavers, G.S.1
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Reynolds number dependence of skin friction and other bulk flow variables in two-dimensional rectangular duct flow
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A general expression for the correlation of rates of transfer and other phenomenon
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