Thermal compact modeling of parallel plate heat sinks

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 136-146

  Narasimhan, Sridhar ^a   Bar Cohen, Avram ^a   Nair, Rajesh ^b  

^a University of Minnesota   (United States)

^b ANSYS INC   (United States)

Author keywords

Compact model; Parallel plate heat sinks; Simplified heat sinks

Indexed keywords

COMPUTATIONAL COMPLEXITY; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE VOLUME METHOD; HEAT TRANSFER COEFFICIENTS; NAVIER STOKES EQUATIONS; POROUS MATERIALS; PRESSURE; THERMAL CONDUCTIVITY;

ELECTRONIC ASSEMBLY; PARALLEL PLATE HEAT SINKS; POROUS BLOCK COMPACT MODEL; SIMPLIFIED HEAT SINKS; THERMAL COMPACT MODELING;

HEAT SINKS;

EID: 0038375027     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.811860     Document Type: Article

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