On heat sink measurement and characterization

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1903-1909

  Kim, Sung J ^a   Lee, Sen ^b  

^a IBM   (United States)

^b Aavid Thermal Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0141929668     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)

1. Azar, K., and Mandrone, C.D., 1994, "Effect of Pin Fin Density of the thermal Performance of Unshrouded Pin Fin Heat Sinks," ASME J. Electronic Packaging, pp. 306-309.
2. Butterbaugh, M.A., and Kang, S.S., 1995, "Effect of Airflow Bypass on the Performance of Heat Sinks in Electronic Cooling," ASME EEP-Vol. 10.2, Advances in Electronic Packaging, pp. 843-848.
3. Lau, K.S., and Mahajan, R.L., 1989, "Effects of Tip Clearance and Fin Density on the Performance of Heat Sinks for VLSI Packages," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, pp. 757-765.
4. Lee, S., 1995, "Optimum Design and Selection of of Heat Sinks," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, pp. 812-817.
5. Lee, R.S., Huang, H.C., and Chen, W.Y., 1990, "A Thermal Characteristic Study of Extruded-type Heat Sinks in Considering Air Flow Bypass Phenomenon," Proceedings of the 6th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), pp. 95-102.
6. Ishaukatullah, H., 1997, "Bibliography on Heat Sinks for Thermal Enhancement of Electronic Packages," Accepted for presentation at 13th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
7. Shaukatullah, H., Storr, W.R, Hansen, B.J., and Gaynes, M.A., 1996, "Design and Optimization of Pin Fin Heat Sinks for Low Velocity Applications," Proceedings of the 12th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), pp. 151-163.
8. Sparrow, E.M., and Kadle, 1986, "Effect of Tip-to-Shroud Clearance on Turbulent Heat Transfer From a Shrouded, Longitudinal Fin Array," ASME J. Heat Transfer Vol. 108, pp. 519-524.
9. Wirtz, R.A., Chen, W., and Zhou, R., 1994, "Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks," ASME J. Electronic Packaging, Vol. 116, pp. 206-211.