Process design of Cu(Sn) alloy deposition for highly reliable ultra large-scale integration interconnects

Thin Solid Films

Volumn 491, Issue 1-2, 2005, Pages 221-227

  Kim, Hoon ^a   Koseki, Toshihiko ^a   Ohba, Takayuki ^a   Ohta, Tomohiro ^a   Kojima, Yasuhiko ^b   Sato, Hiroshi ^b   Shimogaki, Yukihiro ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b TOKYO ELECTRON LTD   (Japan)

Author keywords

Copper tin alloy; Metallization; Nucleation; Wettability

Indexed keywords

AGGLOMERATION; CONFORMATIONS; DEPOSITION; METALLIZING; NUCLEATION; OPTICAL INTERCONNECTS; PROCESS CONTROL; WETTING;

ALLOY DEPOSITION; CONFORMATIONAL DEPOSITION; COPPER-TIN ALLOY; WETTABILITY;

COPPER ALLOYS;

EID: 25144508872     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.05.047     Document Type: Article

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