Electrochemical deposition of Cu and Ni/Cu multilayers in Si Microsystem Technologies

Sensors and Actuators, A: Physical

Volumn 123-124, Issue , 2005, Pages 633-639

  Serre, C ^a   Yaakoubi, N ^b   Martinez S ^a   Perez Rodriguez A ^a   Morante, J R ^a   Esteve, J ^c   Montserrat, J ^c  

^a UNIVERSITY OF BARCELONA   (Spain)

^b UNIVERSITÉ DE TOURS   (France)

^c INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

Author keywords

Electrochemical deposition; Metal layers for Si microsystems; XRD

Indexed keywords

COPPER; ELECTROCHEMISTRY; MICROACTUATORS; NICKEL; STRESS RELAXATION; X RAY DIFFRACTION;

ELECTROCHEMICAL DEPOSITION; METAL LAYERS FOR SI MICROSYSTEMS; SI TECHNOLOGY; STRESS GRADIENTS;

MULTILAYERS;

EID: 24944565586     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2005.04.022     Document Type: Conference Paper

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