Electrochemical deposition of metal layers and structures for Si-based microsystems

Sensors and Actuators, A: Physical

Volumn 99, Issue 1-2, 2002, Pages 41-44

  Martinez S ^a   Yaakoubi, N ^a,b   Perez Rodriguez A ^a   Serre, C ^a   Gorostiza, P ^a   Morante, J R ^a   Esteve, J ^b  

^a UNIVERSITY OF BARCELONA   (Spain)

^b INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

Author keywords

Atomic force microscopy; Micro electro mechanical systems; X ray diffraction

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; CURRENT DENSITY; ELECTRODEPOSITION; GOLD; MORPHOLOGY; MULTILAYERS; NICKEL; OXIDATION; SILICA; SILICON WAFERS; X RAY DIFFRACTION ANALYSIS;

METALLIC LAYERS;

MICROELECTROMECHANICAL DEVICES;

EID: 0037197321     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00895-0     Document Type: Conference Paper

References (5)