Comprehensive broad-band electromagnetic modeling of on-chip interconnects with a surface discretization-based generalized PEEC model

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 3, 2005, Pages 434-444

  Rong, Aosheng ^a,b   Cangellaris, Andreas C ^a   Dong, Limin ^c  

^a University of Illinois at Urbana Champaign   (United States)

^b SOUTHEAST UNIVERSITY   (China)

^c NANJING NORMAL UNIVERSITY   (China)

Author keywords

Electromagnetic modeling; Interconnects; Partial element equivalent circuit (PEEC); Signal integrity

Indexed keywords

ALGORITHMS; EQUIVALENT CIRCUITS; INTEGRATED OPTICS; MATHEMATICAL MODELS;

ELECTROMAGNETIC MODELING; PARTIAL ELEMENT EQUIVALENT CIRCUIT (PEEC); SIGNAL INTEGRITY;

OPTICAL INTERCONNECTS;

EID: 24644484872     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.847837     Document Type: Article

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