Finite-thickness conductor models for full-wave analysis of interconnects with the adaptive integral method

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 45-48

  Morsey, Jason ^a   Okhmatovski, Vladimir ^a   Cangellaris, Andreas C ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL EFFICIENCY; COMPUTATIONAL ELECTROMAGNETICS; ELECTROMAGNETIC FIELDS; ELECTRONICS PACKAGING;

ADAPTIVE INTEGRAL METHOD; ELECTROMAGNETIC FIELD SOLVER; FINITE THICKNESS; FULL WAVE ANALYSIS; INTEGRAL EQUATION METHODS; LOSSY CONDUCTORS; MODELING METHODOLOGY;

INTEGRAL EQUATIONS;

EID: 24644506718     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057880     Document Type: Conference Paper

References (6)

1. M. Kammon, N. A. Marques, L. M. Silveira, and J. White, "Automatic generation of accurate circuit models of 3-D interconnect," IEEE Trans. Comp. Pack. & Manufacturing Tech.-Part B, Vol. 2 1, no. 3, pp. 225-234, Aug. 1998.
2. F. Ling, D. Jiao, and J. M. Jin, "Efficient electromagnetic modeling of microstrip structures in multiplayer media," IEEE Trans. Microwave Theory Tech., vol. 47, no. 9, pp. 1810-1818, Sept. 1999.
3. V. I. Okhmatovski, A. C. Cangellaris Fast electromagnetic analysis of dense shielded integrated circuits using the adaptive integral method Proc. of the 2001 International Microwave Symposium, Phoenix Arizona, June 2001
4. V. I. Okhmatovski, J. Morsey, A. C. Cangellaris An efficient integral equation solver for the electromagnetic modeling of highly-integrated planar RF/microwave circuits Proc. of the 2002 International Microwave Symposium, Seattle Washington, June 2002
5. K. Aygun, M. Lu, B. Shanker, E. Michielssen, "Analysis of PCB level EM1 phonemena using an adaptive low-fiequency PWTD algorithm," in Proceedings ofthe 2000 IEEE In?. Symp. EMC, vol. 1, pp. 295-300,2000.
6. K. M. Coperich, A. E. Ruehli, and A. C. Cangellaris, "Enhanced skin effect for Partial Element Equivalent Circuit (PEEC) models," IEEE Trans. Microwave Theory Tech., vol. 48, pp. 1435-1442, Sept. 2000.