Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 225-228

  Rong, Aosheng ^a   Cangellaris, Andreas C ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; ELECTRIC FIELDS; ELECTROMAGNETISM; EQUIVALENT CIRCUITS; GREEN'S FUNCTION; INTEGRAL EQUATIONS; MAGNETIC COUPLINGS; MATHEMATICAL MODELS; MAXWELL EQUATIONS; POISSON EQUATION; SKIN EFFECT;

ELECTRIC FIELD INTEGRAL EQUATION; PARTIAL ELEMENT EQUIVALENT CIRCUIT METHOD;

ELECTRONICS PACKAGING;

EID: 0035703753     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Equivalent circuit models for three-dimensional multiconductor systems
2. Development of a closed-form expression for the input impedance of power-ground plane structures
3. Electromagnetic scattering by surfaces of arbitrary shape
4. AIM: Adaptive integral method for solving large-scale scattering and radiation problems