Reliable bonding using indium based solders

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5343, Issue , 2004, Pages 114-120

  Cheong, Jongpil ^a   Goyal, Abhijat ^a   Tadigadapa, Srinivas ^a   Rahn, Chris ^a  

^a The Pennsylvania State University   (United States)

Author keywords

Electroplating; Hermetic Sealing; Indium; Indium Tin; Intermediate Layer Bonding; MEMS packaging; Solder bonding; Tensile strength

Indexed keywords

HERMETIC SEALING; INDIUM-TIN; INTERMEDIATE LAYER BONDING; MEMS PACKAGING;

BONDING; ELECTROPLATING; FABRICATION; INDIUM; LOW TEMPERATURE EFFECTS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; RELIABILITY; TENSILE STRENGTH;

SOLDERING ALLOYS;

EID: 2142696850     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.524823     Document Type: Conference Paper

References (16)

1. Wei, J., et al., Low temperature wafer anodic bonding. Journal of Micromechanics and Microengineering, 2003.13(2): p. 217-222.
2. Wallis, G. and D.I. Pomerantz, Field assisted glass-metal sealing. Journal of Applied Physics, 1969. 40(10): p. 3946-9.
3. Maszara, W.P., et al., Bonding of Silicon-Wafers for Silicon-on- Insulator. Journal of Applied Physics, 1988. 64(10): p. 4943-4950.
4. Thompson, K., et al., Direct silicon-silicon bonding by electromagnetic induction heating. Journal of Microelectromechanical Systems, 2002.11(4): p. 285-292.
5. Ristic, L.J., Chapter 4/5, in Sensor Technology and Devices. 1994, Artech House: Boston, MA.
6. Lemmerhirt, D.F. and K.D. Wise. Field-operable microconnections using automatically-triggered localized solder-bonding. in The Fifteenth IEEE International Conference on Micro Electro Mechanical Systems, 2002. 2002.
7. Chan, W.K.Y.-Y., A.; Bhat, R., Tip-chip bonding: solder bonding to the sides of substrates. Electronics Letters. Vol. 28. 1992. 1730-1732.
8. Cheng, Y.T., L. Lin, and K. Najafi, Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging. Journal of Microelectromechanical Systems, 2000. 9(1): p. 3-8.
9. Lee, C.C., C.Y. Wang, and G.S. Matijasevic, A new bonding technology using gold and tin multiplayer composite structures. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991. 14(2): p. 407-12.
10. Singh, A., et al., Batch transfer of microstructures using flip-chip solder bonding. Journal of Microelectromechanical Systems, 1999. 8(1): p. 27-33.
11. Basavanhally, N.R., M.F. Brady, and D.B. Buchholz, Optoelectronic packaging of two-dimensional surface active devices. IEEE Transactions on Components Packaging and Manufacturing Technology Part B-Advanced Packaging, 1996.19(1): p. 107-115.
12. Beelen-Hendrikx, C. and M. Verguld. Trends in electronic packaging and assembly for portable consumer products, in Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456). 2000. Singapore: IEEE.
13. Goyal, A., S. Tadigadapa, and R. Islam, Solder bonding for microelectromechanical (MEMS) fabrication and packaging applications. Proceedings of the SPIE - The International Society for Optical Engineering, 2003. 4980: p. 281-8.
14. Kovacs, G.T.A., Micromachined Transducers-Sourcebook. 1998: McGraw-Hill.
15. Seraphim, D.P., R. Lasky, and C.Y. Li, Principles of Electronic Packaging. 1989: McGraw Hill.
16. Akhnak, M., et al., Development of a segmented annular array transducer for acoustic imaging. Ndt & E International, 2002. 35(7): p. 427-431.