Relationship between C=C bonds and mechanical properties of carbon rich low-k films deposited by plasma enhanced chemical vapor deposition

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 3, 2004, Pages 940-944

  Shim, Cheonman ^a   Jung, Donggeun ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

C C bonds; Low dielectric constant; Mechanical properties; Raman spectrum

Indexed keywords

ANNEALING; CHEMICAL BONDS; ELASTIC MODULI; FOURIER TRANSFORM INFRARED SPECTROSCOPY; FUNCTIONS; HARDNESS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA POLYMERIZATION; RAMAN SPECTROSCOPY;

ANNEALING TEMPERATURE; C-C BONDS; LOW DIELECTRIC CONSTANT; PRECURSORS;

CARBON;

EID: 2442619493     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.940     Document Type: Article

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