Interdiffusion between Cu and Sn-rich solder: Dominant diffusion species

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 81-85

  Kim, Si Jung ^a   Bae, Kyoo Sik ^a  

^a Suwon University   (South Korea)

Author keywords

Aging; Copper alloys; Electronics packaging; Intermetallic; Kinetic theory; Lead; Soldering; Substrates; Temperature; Tin

Indexed keywords

AGING OF MATERIALS; COPPER ALLOYS; COPPER COMPOUNDS; ELECTRONICS PACKAGING; INTERMETALLICS; KINETIC THEORY; LEAD; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; TEMPERATURE; TIN ALLOYS;

AGING PROCESS; CU SURFACES; DIFFUSING SPECIES; KINETIC STUDY; MICRO-STRUCTURAL; REFERENCE LINES; SCALLOP-SHAPED; SN-3.5 AG ALLOYS;

TIN;

EID: 84949562250     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906353     Document Type: Conference Paper

References (11)

1. A. Zribi, R.R. Chromik, R. Presthus, K. Teed, L. Zavalij, J. DeVita, J. Tova, E.J. Cotts, J.A. Clum, R. Erich, A. Primavera, G. Westby, R.J. Coyle, and G.M. Wenger, "Solder Metallization Interdiffsion in Microelectronic Interconnects," IEEE Trans-CPT, Vol. 23, No. 2 (2000), pp. 383-387
2. S. Badar, W. Gust, and H. Hieber, "Rapid Formation of Intermetallic Compounds by Interdiffusion in the Cu-Sn and Ni-Sn Systems," Acta metall.mater., Vol. 43, No. 1, (1995), pp. 329-337
3. W. Yang, L.E. Felton, and R.W. Messler, Jr, "The Effect of Soldering Process Variables on the Microstructure and Mechanical Properties of Eutectic Sn-Ag/Cu Solder Joints," J. Electron. Mater., Vol. 24, No. 10 (1995), pp. 1465-1472
4. S.K. Kang, R.S, Rai, and S. Purushothaman, "Interfacial Reactions During Soldering with Lead-Tin Soders," J. Electron. Mater., Vol. 25, No. 7 (1996), pp. 1113-1120
5. M. Schaefer, R.A. Fournelle, and J. Liang, "Theory for Intermetallic Phase Growth Between Cu and Liquid Sn-Pb Solder Based on Grain Boundary Diffusion Control," J. Electron. Mater., Vol. 27, No. 11 (1998), pp. 1167-1176
6. S.-W. Chen and Y.-W. Yen, "Interfacial Reactions in Ag-Sn/Cu Couples," J. Electron. Mater., Vol. 28, No. 11 (1999), pp. 1203-1208
7. A.S. Zurizi, C.-H. Chiu, S.K. Lahiri, and K.M. Chua, "Kinetics of Copper and High Pb/High Sn Bilayered Pb-Sn Solder Interactions," J. Electron. Mater., Vol. 28, No. 11(1999), pp. 1224-1230
8. M. Onishi and H. Fujibuchi, "Reaction-Diffusion in the Cu-Sn System," Trans. JIM, Vol. 16 (1975), pp. 539-547
9. D.R. Flanders, E.G. Jacobs, and R.F. Pinizzotto, "Activation Energies of Intermetallic Growth of Sn-Ag Eutectic Solder on Copper Substrates," J. Electron. Mater., Vol. 26, No. 7 (1997), pp. 883-887
10. S. Choi, T.R. Bieler, J.P. Lucas, and K.N. Subramanian, "Characterization of the Growth of Intermetallic Interfacial Layers of Sn-Ag and Sn-Pb Eutectic Solders and Their Composite Solders on Cu Substrate During Isothermal Long-Term Aging," J. Electron. Mater., Vol. 28, No. 11 (1999), pp. 1209-1215
11. K.N. Tu, "Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films," Acta Metall., Vol. 21, (1973), pp. 347-354