Low cost bumping by stencil printing: Process qualification for 200 μm pitch

Microelectronics Reliability

Volumn 40, Issue 3, 2000, Pages 497-505

  Kloeser, Joachim ^a   Heinricht, Katrin ^a   Jung, Erik ^a   Lauter, Liane ^b   Ostmann, Andreas ^b   Aschenbrenner, Rolf ^a   Reichl, Herbert ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; FLIP CHIP DEVICES; PRINTED CIRCUIT MANUFACTURE; SOLDERING;

SOLDER BUMPS; STENCIL PRINTING;

ELECTRONICS PACKAGING;

EID: 0033907653     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(99)00237-1     Document Type: Article

References (18)

1. Vardaman EJ, Goodman T. FCIP and expanding markets for flip chip. Tech-Search International Industry Report, July 1997.
2. Belmonte J, Johnson A, Pernice B. Bumping wafers using stencil printing. Proceedings of the Nepcon West Conference. Anaheim, CA, 1998.
3. Stepniak F. Solder flip chips employing electroless nickel: an evaluation of reliability and cost. Adv Electron Packaging 1997;1.
4. Wong K, Chi K, Rangappan A. Application of electroless Ni plating in the semi-conductor microcircuit industry. Plat and Surf Finishing 1988;70-6.
5. Yamakawa K, Inaba M, Iwase N. Maskless bumping by electroless plating for high pin count, thin and low cost microcircuits. Proceedings of the ISHM. Baltimore, 1989. p. 620-6.
6. Simon J, Zakel E, Reichl H. Electroless deposition of bumps for TAB technology. Metal Finishing 1990;23-6.
7. Ostmann A, Simon J, Reichl H. The pre-treatment of Al bondpads for electroless nickel bumping. Proceedings of the IEEE MCM Conference. Santa Cruz, 1993. p. 74-8.
8. Aintila A, Björklöf A, Järvinen E, Lalu S. Electroless Ni/ Au bumps for flip chip-on-flex and TAB applications. Proceedings of the IEEE International Electronic Manufacturing Techn Symposium, 1994. p. 160-3.
9. Audet J, Belanger L, Brouillette G, Dano-vitch D, Oberson V. Low cost bumping process for flip chip. Proceedings of the ITAB Symposium. San Jose, 1995. p. 16-21.
10. Ostmann A, Kloeser J, Reichl H. Implementation of a chemical wafer bumping process. Proceedings of the IEPS, 1995. San Diego, USA.
11. Ostmann A, Kloeser J, Zakel E, Reichl H. A low cost bumping technology using electroless nickel/gold. Proceedings of the ITAB Symposium. San Jose, 1995.
12. Kloeser J, et al. Approaches to flip chip technology using electroless nickel-gold bumps. Proceedings of the 1995 Japan IEMT Symposium. Omiya, Japan, p. 60-6.
13. Ostmann A, Kloeser J, Zakel E, Reichl H. A low cost bumping technology using electroless nickel/gold bumping. Proceedings of the ITAB Symposium. Sunnywale, USA, 1996. p. 152.
14. SMT-Magazine, 1996. p. 29.
15. Markstein HW. Controlling the variables in stencil printing. Electronic Packaging and Prod 1997;48-56.
16. Li Y, Mahajan RL, Nikmanesh N. Fine pitch stencil printing process modeling and optimization. Trans ASME J Electronic Packaging 1996;18:1-6.
17. Heinricht K, Kloeser J, Lauter L, Ostmann A, Wolter A, Reichl H. Quality and yeild of ultra fine pitch stencil printing for flip chip assembly. Proceedings of the EUPAC Conference. Nürnberg, Germany, 1998.
18. Kloeser J, et al. Reliability investigations of Pb/Sn and lead free solders for flip chip technology. Proceedings of the Pan Pacific Conference. Hawaii, USA, 1998.