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Volumn 42, Issue 5, 2001, Pages 769-775
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Aging behavior of a Sn-Bi eutectic solder at temperatures between 233 and 373 K
a
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Author keywords
Hardness; Isothermal aging; Lamellae structure; Lattice constant; Lead free solder; Tin bismuth eutectic solder
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Indexed keywords
AGING OF MATERIALS;
BISMUTH;
DISSOLUTION;
EUTECTICS;
HARDNESS;
LATTICE CONSTANTS;
METALLOGRAPHIC MICROSTRUCTURE;
TEMPERATURE;
TIN;
X RAY DIFFRACTION ANALYSIS;
ELECTRON PROBE MICROANALYSIS;
ISOTHERMAL AGING;
LAMELLAR STRUCTURE;
LEAD FREE SOLDER;
SOLDERING ALLOYS;
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EID: 0034938911
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.42.769 Document Type: Article |
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Times cited : (4)
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References (8)
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