Microstructural features of lift-off phenomenon in through-hole circuit soldered by Sn-Bi alloy

Scripta Materialia

Volumn 38, Issue 9, 1998, Pages 1333-1340

  Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SOLDERING; TIN ALLOYS;

LIFT OFF; THROUGH HOLE CIRCUIT;

MICROSTRUCTURE;

EID: 0032478374     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(98)00059-1     Document Type: Article

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