A flip-chip packaged coplanar 94 GHz amplifier module with efficient suppression of parasitic substrate effects

IEEE Microwave and Wireless Components Letters

Volumn 14, Issue 4, 2004, Pages 145-147

  Tessmann, Axel ^a   Riessle, Markus ^a   Kudszus, Steffen ^b   Massler, Hermann ^a  

^a FRAUNHOFER INSTITUTE FOR APPLIED SOLID STATE PHYSICS IAF   (Germany)

^b Big Bear Networks   (United States)

Author keywords

Coplanar waveguide; Flip chip packaging; GaAs; Lossy substrates; MMIC; W band

Indexed keywords

AMPLIFIERS (ELECTRONIC); CHARGE CARRIERS; CHIP SCALE PACKAGES; CIRCUIT THEORY; ELECTRIC CONDUCTIVITY; ELECTRIC LINES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTING GALLIUM ARSENIDE; WAVEGUIDES;

COPLANAR WAVEGUIDES (CPW); FLIP CHIP PACKAGING; LOSSY SUBSTRATES; W-BAND;

FLIP CHIP DEVICES;

EID: 2442473456     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2004.827115     Document Type: Article

References (9)

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