A new flip-chip MMIC technology with multi-layer transmission line structure for low-cost W-band transceivers

Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit)

Volumn , Issue , 2001, Pages 118-121

  Masuda, S ^a   Hirose, T ^a   Yokokawa, S ^a   Nishi, M ^a   Iijima, S ^a   Ono, K ^a   Watanabe, Y ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); FLIP CHIP DEVICES; MICROSTRIP DEVICES; POWER AMPLIFIERS; SUBSTRATES; THIN FILMS; TRANSCEIVERS;

RECEIVER AMPLIFIERS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0035167758     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. A flip-chip MMIC design with coplanar waveguide transmission line in the W-band
2. 76 GHz flip-chip MMICs for automotive radars
3. 76 GHz automotive radar chipset with stabilizing method for face-down high-frequency circuits
4. A flip chip bonding technology using gold pillars for millimeter-wave applications