Avoiding cross talk and feed back effects in packaging coplanar millimeter-wave circuits

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1998, Pages 1091-1094

  Krems, T ^a   Tessmann, A ^a   Haydl, W H ^a   Schmelz, C ^a   Heide, P ^a  

^a FRAUNHOFER INSTITUTE FOR APPLIED SOLID STATE PHYSICS IAF   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; ELECTRONICS PACKAGING; FEEDBACK; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SUBSTRATES;

CIRCUIT DEGRADATION; COPLANAR MILLIMETER WAVE CIRCUITS; PARASITIC SUBSTRATE MODES;

MILLIMETER WAVE DEVICES;

EID: 0031630983     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)