The thermal annealing effect on the residual stress and interface adhesion in the compressive stressed DLC film

Materials Research Society Symposium - Proceedings

Volumn 795, Issue , 2003, Pages 87-92

  Choi, Heon Woong ^a   Moon, Myoung Woon ^a   Kim, Tae Young ^a,b   Lee, Kwang Ryeol ^b   Oh, Kyu Hwan ^a  

^a Seoul National University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; BUCKLING; CHEMICAL VAPOR DEPOSITION; DELAMINATION; ELASTIC MODULI; GRAPHITIZATION; RAMAN SPECTROSCOPY; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; STRESS ANALYSIS; THERMAL EFFECTS; THICK FILMS; TRANSMISSION ELECTRON MICROSCOPY;

CHEMICAL INERTNESS; INTERFACE ADHESION; OPTICAL TRANSPARENCY; RAPID THERMAL PROCEDURE SYSTEM;

DIAMOND LIKE CARBON FILMS;

EID: 2442438850     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-795-u11.42     Document Type: Conference Paper

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