Mechanical stability of DLC films on metallic substrates Part II - Interfacial toughness, debonding and blistering

Thin Solid Films

Volumn 312, Issue 1-2, 1998, Pages 219-227

  Peng, X L ^a   Clyne, T W ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Adhesion; Carbon; Diamond; Stress

Indexed keywords

ADHESION; ALUMINUM; ARGON; FILM PREPARATION; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); RESIDUAL STRESSES; SEMICONDUCTING SILICON; SPUTTER DEPOSITION; STRAIN RATE; THERMAL EFFECTS;

BLISTERING; DEBONDING;

DIAMOND FILMS;

EID: 0031675505     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00703-7     Document Type: Article

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