Effects of shrinkage on conductivity of isotropic conductive adhesives

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 295-301

  Daoqiang, Lu ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; DIFFERENTIAL SCANNING CALORIMETRY; INTERFACES (MATERIALS); PACKAGING MATERIALS; RESINS; SHRINKAGE;

CONDUCTIVE ADHESIVE; CONDUCTIVE FILLERS; DIFFERENTIAL SCANNING CALORIMETERS; ELECTRICAL CONDUCTIVITY; ISOTROPIC CONDUCTIVE ADHESIVES; ON CONDUCTIVITIES; RESIN CURE SHRINKAGE; THERMOMECHANICAL ANALYZERS;

CURING;

EID: 85037083723     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757329     Document Type: Conference Paper

References (15)

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