A novel thermomechanics -based lifetime prediction model for cycle fatigue failure mechanisms in power semiconductors

Microelectronics Reliability

Volumn 42, Issue 9-11, 2002, Pages 1653-1658

  Ciappa, M ^a   Carbognani, F ^b   Cova, P ^b   Fichtner, W ^a  

^a ETH ZURICH   (Switzerland)

^b UNIVERSITY OF PARMA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

THERMAL CYCLING;

COMPLIANT MATERIALS; FATIGUE FAILURES; FUNDAMENTAL EQUATIONS; LIFETIME PREDICTION MODELS; MISSION PROFILE; POWER SEMICONDUCTORS; STATISTICAL DISTRIBUTION; THERMO-MECHANICS;

FATIGUE DAMAGE;

EID: 0037766952     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00206-8     Document Type: Conference Paper

References (5)

1. Ciappa M., Fichtner W. Lifetime prediction of IGBT modules for traction applications IEEE Int. Reliab. Physics Symp. 38(2000)210-216
2. Ciappa M., Malberti P., Fichtner W., Cova P., Cattani L., Fantini F. Lifetime extrapolation for IGBT models under Realistic Operation Conditions Microelectronic Reliability 39(1999)1131-1136 (Pubitemid 129304844)
3. Schubert A., Walter H., Dudek R., Michel B., Lefranc G.,Otto J., Mitic G. Thermo-Mechanical Properties and Creep Deformation of Lead-Containing and Lead-Free Solders Proc. of the 34th Int. Symposium on Microelectronics IMAPS (2001), Baltimore, October 9-11, 2001
4. RubesaD. Lifetime prediction and constitutive modelling for creep-fatigue interaction Borntraeger, Berlin 1991
5. Yun C, Malberti P., Ciappa M., Fichtner W. Thermal Component Model for Electrothermal Analysis of IGBT Module Systems IEEE Trans, on Adv. Packaging 24(2001)401-406 (Pubitemid 32780079)