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The thermal effect in our devices will be negligible as explained below. The upper limit of the temperature increase caused by the laser illumination on SiNWs can be estimated based on the Si thermal resistivity (0.76 K·cm/W at 300 K) and the device geometry, assuming that all of the absorbed photons are converted to heat. The estimated value is less than 2 K when the light with an intensity of 100 kW/cm2 illuminated the middle of a SiNW (where heat dissipation is the slowest) and if there is no heat dissipation through the silicon oxide substrate. The thermoelectric potential will be around 1 mV in this case, which can create a thermoelectric current as much as a few nA. This is smaller by 1 order of magnitude than the typical SPC measured from our devices. Furthermore, the actual temperature increase will be much smaller if the light is located near the contact where heat dissipation is faster and if we allow heat dissipation through the substrate. In addition, not all of the photon energy will be converted to heat in real devices.
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