A new method of current density control during the pulse plating process

Transactions of the Institute of Metal Finishing

Volumn 83, Issue 3, 2005, Pages 148-153

  Gladstein, M ^a   Guterman, H ^a  

^a BEN GURION UNIVERSITY OF THE NEGEV   (Israel)

Author keywords

Current density; Overpotential control; Pulse plating

Indexed keywords

CURRENT DENSITY; ELECTRODEPOSITION; ELECTRODES; GOLD; MORPHOLOGY; THICKNESS MEASUREMENT;

DIRECT CURRENT (DC) PLATING; GOLD PULSE PLATING; OVERPOTENTIAL CONTROL; PULSE PLATING;

PLATING;

EID: 22744442459     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1179/002029605X48914     Document Type: Article

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