Manufacturing ultra fine line PBGA substrates in a PWB factory

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 2, 2000, Pages 132-136

  Wilson, James W ^a   Sebesta, Robert D ^a   D'Aloisio, Albert ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; PLASTIC LAMINATES; POLYIMIDES; PRINTED CIRCUIT BOARDS; SUBSTRATES;

PLASTIC BALL GRID ARRAY (PBGA) SUBSTRATES;

ELECTRONICS PACKAGING;

EID: 0034172318     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.846936     Document Type: Article

References (6)

1. G. Delisle, E. Dibble, and J. Fuller, "Transition: Lessons learned in the development and production of IBM's uLaminate PBGA," Proc. 46th Electron. Comp. Technol. Conf., May 1996, pp. 1244-1250.
2. J. W. Fuller and E. M. Norton, "The execution of aggressive PBGA substrate yield learning in an existing PWB facility," Proc. 48th Electron. Comp. Technol. Conf., May 1998, pp. 834-837.
3. S. T. Lee and J. M. McCreary, "Metal-polyimide-metal technology for module applications," Proc. VLSI Int. Symp., vol. 1, 1987, pp. 69-73.
4. S. R. Engle, P. G. Gregory, and S. P. Moore, "Ceramic quad flatpack SMT package," presented at the IPC Fall Meeting, Minneapolis, MN, Oct. 1992.
5. "Ceramic chip carrier with lead frame or edge clip," U.S. Patent 5 243 133, 1991.
6. M. J. Kuzawinski and K. J. Blackwell, "Ultra fine pitch wire bond PBGA's," Electron. Packag. Prod., pp. 56-62, Sept. 1997.