A novel method of controlling metal deposition during a pulse plating process

Plating and Surface Finishing

Volumn 88, Issue 3, 2001, Pages 78-79

  Gladstein, Michael ^a   Guterman, Hugo ^a  

^a BEN GURION UNIVERSITY OF THE NEGEV   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042882103     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)

1. P. Baldwin, Metal Finishing, 95, (1) (1995).
2. E. Gileadi, Electrode Kinetics, VCH Publishers, Inc., New York, NY, 1993, p. 154.
3. A. Ruffoni, D. Landolt, J. Electrochim. Acta, 33, (10) (1988).
4. E. Raub, K. Muller, Fundamentals of Metal Deposition, Elsevier Publishing Company, Inc., New York, NY, 1967, p.204.