Current distribution and current efficiency in pulsed current plating of nickel

Journal of the Electrochemical Society

Volumn 143, Issue 9, 1996, Pages 2770-2776

  Kwok, S I ^a,c   Jeong, K M ^a,d   Kim, S K ^a   Sohn, H J ^a,b  

^a Seoul National University   (South Korea)

^b ELECTROCHEMICAL SOCIETY

^c Dongbu Hannong Chemical Co   (South Korea)

^d Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; DIFFUSION; ELECTRIC CURRENTS; ELECTRODES; ELECTROLYTES; HYDROGEN; MATHEMATICAL MODELS;

BORIC ACID; CURRENT DISTRIBUTION; CURRENT EFFICIENCY; HYDROGEN CONCENTRATION; OHMIC DROP; PULSE CURRENT DENSITY; PULSED CURRENT PLATING;

NICKEL PLATING;

EID: 0030247491     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837105     Document Type: Article

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