A new approach to controlling metal deposition during the pulse plating process

Metal Finishing

Volumn 100, Issue 8, 2002, Pages 26-33

  Gladstein, M ^a   Guterman, H ^a  

^a BEN GURION UNIVERSITY OF THE NEGEV   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CATHODES; CONTROL SYSTEMS; CURRENT DENSITY; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTRIC RESISTANCE; ELECTRIC WIRING; ELECTRONIC EQUIPMENT; MULTILAYERS; PLATING;

CURRENT DENSITY STABILIZATION; METAL ELECTRODEPOSITION; OVERPOTENTIAL STABILIZATION; PULSE PLATING PROCESS;

ELECTRODEPOSITION;

EID: 0012743351     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-0576(02)80688-2     Document Type: Note

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