Mass Transfer Models for the Electrodeposition of Copper with a Buffering Agent

Journal of the Electrochemical Society

Volumn 148, Issue 4, 2001, Pages

  Gill, William N ^a   Duquette, David J ^b,c   Varadarajan, Desikan ^a  

^a Rensselaer Polytechnic Institute   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0011245695     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1354618     Document Type: Article

References (20)

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