An Analytical Equation to Compute the Composition of Pulse-Plated Binary Alloys

Plating and Surface Finishing

Volumn 86, Issue 4, 1999, Pages 76-79

  Roy, Sudipta ^a  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003094172     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (14)

1. M.W. Verbrugge & C.W. Tobias, J. Electrochem. Soc., 134, 3104 (1987).
2. A.M. Pesco & H.Y. Cheh, ibid., 135, 1722 (1988).
3. A. Ruffoni & D. Landolt, Electrochim. Acta, 33, 1281 (1988).
4. K.M. Yin & R.E. White, AIChE J., 36, 187 (1990).
5. S. Roy, M. Matlosz & D. Landolt, J. Electrochem. Soc, 141, 1509 (1994).
6. A. Brenner, Electrodeposition of Alloys, Principles and Practice, Vol. 1, Academic Press Inc., New York, NY, 1963; pp. 558-573.
7. C.A. Ross, Annual Rev. Mater. Sci., 24, 159 (1994).
8. T. Tsalakos & A.F. Jankowski, ibid., 16, 293 (1986).
9. C. Madore, PhD Thesis, EPFL, Switzerland (1993).
10. S. Roy & D. Landolt, J. Electrochem. Soc., 142, 3021 (1995).
11. M. Eisenberg, C.W. Tobias & C.W. Wilke, ibid., 101, 307 (1954).
12. B. Gebhart & L. Pera, Int. J. Heat Mass Transfer, 14, 2025 (1971).
13. V. Anantharaman, P.N. Pintauro & L. Nanis, J. Electrochem. Soc., 136, 1727 (1989).
14. S. Roy Devarajan, PhD Thesis, Tulane University, 1992, UMI Order Number 9229791.