Fracture toughness measurement of thin-film silicon

Fatigue and Fracture of Engineering Materials and Structures

Volumn 28, Issue 8, 2005, Pages 687-694

  Ando, Taeko ^a   Li, X ^a   Nakao, S ^a   Kasai, T ^a   Tanaka, H ^b   Shikida, M ^a   Sato, K ^a  

^a NAGOYA UNIVERSITY   (Japan)

^b DENSO CORPORATION   (Japan)

Author keywords

Fracture toughness; MEMS; Silicon; Single crystal; Thin film

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; MECHANICAL VARIABLES MEASUREMENT; MICROELECTROMECHANICAL DEVICES; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SINGLE CRYSTALS; STRESSES; TENSILE TESTING; THIN FILMS;

FRACTURE STRESS; FRACTURE TOUGHNESS MEASUREMENT; SINGLE CRYSTAL SILICON; THIN FILM SILICON;

SILICON;

EID: 22644448184     PISSN: 8756758X     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1460-2695.2005.00920.x     Document Type: Article

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