Study on the thermal conductivity and microstructure of silicon nitride used for power electronic substrate

Materials Science and Engineering: B

Volumn 99, Issue 1-3, 2003, Pages 475-478

  Xu, Wei ^a   Ning, Xiao Shan ^a   Zhou, He Ping ^a   Lin, Yuan Bo ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Microstructure; Silicon nitride; Thermal conductivity

Indexed keywords

CERAMIC MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; GRAIN BOUNDARIES; MICROSTRUCTURE; POWER ELECTRONICS; SINTERING; THERMAL CONDUCTIVITY OF SOLIDS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

POWER ELECTRONIC SUBSTRATES;

SILICON NITRIDE;

EID: 0038687172     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(02)00483-X     Document Type: Conference Paper

References (5)

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