Selective induction heating for MEMS packaging and fabrication

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn 2, Issue , 2001, Pages 3335-3339

  Cao, Andrew ^a   Lin, Liwei ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DOPING (ADDITIVES); ELECTRIC FIELD EFFECTS; ENERGY DISSIPATION; EUTECTICS; FINITE ELEMENT METHOD; HEAT TRANSFER; INDUCTION HEATING; MAGNETIC FIELD EFFECTS; MAGNETIC PERMEABILITY; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY;

EDDY CURRENT DISTRIBUTION; ELECTROMAGNETIC INDUCTION; HEAT GENERATION RATES;

ELECTRONICS PACKAGING;

EID: 1542411490     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Cheng, Y.T.; Liwei Lin; Najafi, K. "Fabrication and hermeticily testing of a glass-silicon package formed using localized aluminiun/silicon-to-glass bonding" (Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat, No.00CH36308), Proceedings IEEE Thirteenth. Annual International Conference on Micro Electro Mechanical Systems, Miyazaki, Japan, pp 23-27 Jan.
2. Mu Chiao and Liwei Lin, "Hermetic Wafer Bonding Based on Rapid Thermal Processing. Solid-State Sensor and Actuator Workshop. Hilton Head Island, South Carolina. June 4-8, 2000, pp347-350.
3. Y. T. Cheng, W. T. Hsu, L. Lin, C. T. Nguyen, and K. Najafi. "Vacuum Packaging Technology Using Localized Aluminum/Silicon-to Glass Bonding", Technical Digest of the 2001 Micro Electiro Mechanical System. Interlaken, Switzerland, pp 18-21.
4. Cheng, Y.T.; Lin, L.; Najafi, K. Localized bonding with PSG or indium solder as intermediate layer. Proceedings of 12th International Workshop on Micro Electro Mechanical Systems - MEMS, Orlando, FL, USA, 17-21 Jan. 1999.) Piscataway, NJ, USA: IEEE, 1999, pp.285-9
5. Y. T. Cheng, L. Lin, K. Najafi, "Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging", Technical Digest of the 1998 Solid State Sensor and Actuator Workshop, Hilton Head, pp 233-236, 1998
6. Liwei Lin, Yu-Ting Cheng and Khalil Najafi, "Formation of Silicon-Gold Eutectic Bond Using Localized Heating Method", Journal of Applied Physics, vol. 37, pp 1412-1414
7. th International Conference on Solid-State Sensors and Actuators
8. Sarah A. Audet, Katrina M. Edenfeld "Integrated Sensor Wafer-Level Packaging". 1997 International Conference on Solid-State Sensors and Actuators. Chicago, June, pp 16-19, 1997
9. Davies, J. Simpson. P. Induction Heating Handbook. McGraw-Hill Book Company (UK) limited. 1926
10. MUMPS, multi user MEMS process offered by Cronos, www.memsrus.com/cronos/svcsmumps.html