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Volumn , Issue , 1996, Pages 552-558
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Fluxless no-clean assembly of solder bumped flip chips
a
a
MCNC
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
ASSEMBLY;
CERAMIC MATERIALS;
EUTECTICS;
LEAD ALLOYS;
MICROELECTROMECHANICAL DEVICES;
PLASMA APPLICATIONS;
PRINTED CIRCUIT BOARDS;
SOLDERING;
SOLDERING ALLOYS;
TIN ALLOYS;
BALLING REFLOW;
FLUXLESS NO CLEAN ASSEMBLY;
MICROSOCKETS;
MULTILAYER CERAMICS;
PLASMA ASSISTED FLUXLESS SOLDERING;
SOLDER REFLOW;
SOLDERED BUMPED FLIP CHIPS;
FLIP CHIP DEVICES;
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EID: 0029696374
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (10)
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References (16)
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