Fluxless soldering of flip chip assemblies

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 1, Issue , 1996, Pages 96-110

  Dong, C Christine ^a   Arslanian, Gregory K ^a   Bonda, Rao ^a  

^a AIR PRODUCTS AND CHEMICALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP ASSEMBLY; FLUXLESS SOLDERING; HYDROGEN SOLDERING; ISOTHERMAL REDUCTION RATE; NITROGEN SOLDERING; REFLOW TEMPERATURE; SOLDER BUMPS; SOLDER WETTING;

ASSEMBLY; BONDING; FLIP CHIP DEVICES; HYDROGEN; INTERFACES (MATERIALS); NITROGEN; OXIDES; SOLDERING; THERMAL EFFECTS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0029694259     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)