Compact quasi-analytic equations for estimating the temperature distribution of ULSI interconnections

Microelectronic Engineering

Volumn 60, Issue 3-4, 2002, Pages 415-428

  Xiao, X ^a   You, X ^b   Ruan, G ^c  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^c FUDAN UNIVERSITY   (China)

Author keywords

Interconnection; Thermal behavior simulation; ULSI circuits

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; HEAT LOSSES; LARGE SCALE SYSTEMS; PERMITTIVITY; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

QUASI-ANALYTIC EQUATIONS;

ULSI CIRCUITS;

EID: 0036532294     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(01)00702-X     Document Type: Article

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