On thermal effects in deep sub-micron VLSI interconnects

Proceedings - Design Automation Conference

Volumn , Issue , 1999, Pages 885-891

  Banerjee, Kaustav ^a   Mehrotra, Amit ^a   Sangiovanni Vincentelli, Alberto ^a   Hu, Chenming ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; DIGITAL SIGNAL PROCESSING; DYNAMIC RANDOM ACCESS STORAGE; ELECTROSTATICS; INTERCONNECTION NETWORKS; THERMAL EFFECTS;

DEEP SUB-MICRON INTERCONNECTS;

VLSI CIRCUITS;

EID: 0032650608     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/309847.310093     Document Type: Conference Paper

References (27)