Integrated thermomechanical design and optimization of BGA packages using genetic algorithm

Proceedings of the ASME Heat Transfer/Fluids Engineering Summer Conference 2004, HT/FED 2004

Volumn 4, Issue , 2004, Pages 495-502

  Hadim, Hamid A ^a   Suwa, Tohru ^a  

^a Stevens Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; DESIGN; ELECTROMAGNETIC FIELD EFFECTS; ELECTRONICS PACKAGING; GENETIC ALGORITHMS; MICROPROCESSOR CHIPS; OPTIMIZATION; STRAIN;

BALL GRID ARRAY (BGA); ELECTROMAGNETIC LEAKAGE; PACKAGE DESIGNS; THERMAL STRAIN;

THERMOMECHANICAL TREATMENT;

EID: 21544443441     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ht-fed2004-56512     Document Type: Conference Paper

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