Multi-objective placement optimization of power electronic devices on liquid cooled heat sinks

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2001, Pages 117-119

  Gopinath, Deepak ^a   Joshi, Yogendra K ^a   Azarm, Shapour ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Compact Thermal Models; Electronic Packaging; Multi Objective Genetic Algorithms; Optimal Placement; PEBB

Indexed keywords

GENETIC ALGORITHMS; HEAT LOSSES; OPTIMIZATION; POWER ELECTRONICS; PRINTED CIRCUIT BOARDS; WATER COOLING SYSTEMS;

MULTI OBJECTIVE GENETIC ALGORITHMS (MOGA); POWER ELECTRONIC DEVICES;

HEAT SINKS;

EID: 0035019290     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2001.915159     Document Type: Article

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