Multi-objective design of liquid cooled power electronic modules for transient operation

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 215-222

  Kaczorowski, Przemyslaw R ^a   Joshi, Yogendra ^a   Azarm, Shapour ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; COMPUTER SIMULATION; COOLING; GENETIC ALGORITHMS; MATHEMATICAL MODELS; OPTIMIZATION; PARETO PRINCIPLE; PRESSURE DROP; TEMPERATURE; THERMODYNAMICS; CHIP SCALE PACKAGES; DESIGN; DISTRIBUTED COMPUTER SYSTEMS; ELECTRIC IMPEDANCE; ELECTRONICS PACKAGING; HEAT RESISTANCE; IMPULSE RESPONSE; MECHANICAL ENGINEERING; MULTIOBJECTIVE OPTIMIZATION; POWER ELECTRONICS; TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL; THERMAL VARIABLES MEASUREMENT;

MULTIOBJECTIVE DESIGN; THERMAL IMPEDANCE NETWORK MODEL; THERMAL MODEL;

POWER ELECTRONICS; THERMAL CONDUCTIVITY;

COMPUTATIONALLY EFFICIENT; DESIGN OPTIMIZATION; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; MULTI-OBJECTIVE DESIGN; POWER ELECTRONIC MODULES; STEADY-STATE CONDITION; THERMAL PERFORMANCE; TRANSIENT THERMAL MODELS;

EID: 0037272216     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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