Wafer-Level Vacuum Packaging Technology Based on Selective Electroplating

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5342, Issue , 2004, Pages 26-34

  Topart, P ^a   Leclair, S ^a   Alain, C ^a   Jerominek, H ^a  

^a INO   (Canada)

Author keywords

Electroplating; Infrared microbolometers; MEMS; Wafer level vacuum packaging

Indexed keywords

INFRARED MICROBOLOMETERS; MEMS; THERMAL CONDUCTANCE; WAFER-LEVEL VACUUM PACKAGING;

BOLOMETERS; CHEMICAL POLISHING; ELECTRONICS PACKAGING; ELECTROPLATING; FLIP CHIP DEVICES; GRAIN SIZE AND SHAPE; HERMETIC DEVICES; INDIUM; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; OPTICAL ENGINEERING; SCANNING ELECTRON MICROSCOPY; SOLDERING; SURFACE ROUGHNESS; THERMAL CONDUCTIVITY; TRANSPARENCY;

VACUUM TECHNOLOGY;

EID: 2142825314     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.525802     Document Type: Conference Paper

References (15)

1. K. Najafi, "Micropackaging technologies for integrated microsystems: Applications to MEMS and MOEMS", Proc. SPIE, Vol. 4979, 2003, 1-19.
2. T. D. Pope, "Commercial and custom 160×120, 256×1 and 512×3 Pixel Bolometric FPAs" Proc. SPIE, Vol. 4721, 2002. p. 64-74.
3. R. Goosh and T. Schimert, "Low-cost wafer-level vacuum packaging for MEMS", MRS Bulletin, 2003, 55-59
4. Goyal, S. Tadigadapa and R. Islam, "Solder bonding for microelectromechanical systems (MEMS) applications" Proc. SPIE Vol. 4980, 2003, 281-288.
5. B. O' Neill, "Solder Selection for Photonic Packaging", Proc. IMAPS OPTO-ATW, 2002, Bethlehem.
6. B. Loechel, "Thick-layer resists for surface micromachining", J. Micromech. Microeng. 10, 2000, 108-115.
7. C.-H. Ho and W. Hsu, "Characterization of embedded root method in UV-LIGA process", Proc. SPIE, Vol. 5116, 2003, 424-434.
8. H. A. C. Tilmans, D. J. Van de Peer and E. Beyne, "The IRS technique: a method for the fabrication of sealed cavities for MEMS devices" J. Microelectromechanical. Systems., 9, 2000, 206-217.
9. Y. Tao, A. P. Malshe and W.D. Brown, "Laser-assisted selective bonding for wafer-level and chip-scale vacuum packaging of MEMS and related Microsystems", International Symposium on Microelectronics, 2002, 93-98.
10. th IEEE Int. Conf. On MEMS, 2002, 677-680.
11. D. Sparks, S. Massoud-Ansari and N. Najafi, "Chip-level vacuum Packaging of micromachines using nanogetters", IEEE Transactions on Advanced Packaging, 26, 2003, 277-286.
12. B. Sutter in Theory and Practice of Pulse Plating, Chap. 8, J. C. Puippe and F. Leaman Eds., AESF, Orlando, USA, 1986, p.101.
13. W. Kleinekathöfer and C. J. Raub, "Die Abscheidung von Nickel mit Pulsierendem Strom", Surface Technology, 7, 1978, 23-34.
14. S. Mehdizadeh, J. O. Dukovic, P. C. Andricacos and L. T. Romankiw, "The influence of lithographic patterning on current distribution: a model for microfabrication by electrodeposition", J. Electrochem. Soc, 139, 1992, 78-91.
15. C. Alain, H. Jerominek, P. Topart, T. Pope, F. Picard, F. Cayer, C. Larouche, S. Leclair et B. Tremblay, "Microfabrication services at INO", Proc. SPIE, Vol. 4979, 2003, 353-363.