Solder bonding for microelectromechanical systems (MEMS) applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4980, Issue , 2003, Pages 281-288

  Goyal, Abhijat ^a   Tadigadapa, Srinivas ^a   Islam, Rafiqul ^b  

^a The Pennsylvania State University   (United States)

^b EV Group Inc   (United States)

Author keywords

Eutectic bonding; MEMS; Packaging; Solder bonding

Indexed keywords

BONDING; ELECTRONICS PACKAGING; EUTECTICS; SOLDERING;

SOLDER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0038397291     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.478202     Document Type: Conference Paper

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