Optoelectronic packaging of two-dimensional surface active devices

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 107-115

  Basavanhally, Nagesh R ^a   Brady, Michael F ^a   Buchholz, D Bruce ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

Flip chip assembly; Microlens array; Optoelectronic package; Self electro optic effect devices; Surface emitting lasers

Indexed keywords

ASSEMBLY; ELECTRONICS PACKAGING; ELECTROOPTICAL EFFECTS; HEAT SINKS; LASERS; LENSES; OPTICAL DEVICES; OPTICAL INTERCONNECTS; SOLDERING;

FLIP CHIP ASSEMBLY; MICROLENS ARRAYS; OPTICAL ALIGNMENT; OPTOELECTRONIC PACKAGING; OPTOELECTRONIC SYSTEMS; PARALLEL INTERCONNECTION TECHNOLOGY; SELF ELECTROOPTIC EFFECT DEVICES; SOLDER REFLOW PROCESS; SURFACE EMITTING LASERS; TWO DIMENSIONAL SURFACE ACTIVE DEVICES;

OPTOELECTRONIC DEVICES;

EID: 0030084698     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486492     Document Type: Article

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