Trends in electronic packaging and assembly for portable consumer products

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 24-32

  Beelen Hendrikx, C ^a   Verguld, M ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Assembly; Chip scale packaging; Consumer electronics; Consumer products; Costs; Electronic packaging thermal management; Electronics packaging; Lead; Production; Radio frequency

Indexed keywords

CHIP SCALE PACKAGES; CONSUMER ELECTRONICS; CONSUMER PRODUCTS; COSTS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LEAD; PRINTED CIRCUITS; PRODUCTION; SUBSTRATES; VOLATILE ORGANIC COMPOUNDS;

CHIP-SCALE PACKAGING; ELECTRONIC ASSEMBLIES; ELECTRONIC PACKAGING; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; ENVIRONMENTALLY FRIENDLY PRODUCTS; HIGH DENSITY INTERCONNECTS; INTEGRATED PASSIVE COMPONENTS; RADIO FREQUENCIES;

ASSEMBLY;

EID: 84949553237     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906345     Document Type: Conference Paper

References (7)

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